Product

NEMST-2002ILT 系列

In-line Plasma Cleaner (Tray Type)

In-line Plasma Cleaner (Tray Type)
In-line Plasma Cleaner (Tray Type)
  • By employing high frequency RF power supply and unique plasma electrodes design, high density plasma can be induced.
  • Using Ar or O2 as the reaction gases for plasma.
  • Cycle Time is about 30 seconds and 2 Jedec trays can be treated in one cycle simultaneously.
  • Freindly operating interface for convenient, safe and stable production..
  • Can be standalone machine or connect with upstream and downstream tools.
  • Multiple Processing Gases (Ar, O2, H2, mixed gas, etc.) capable of achieving the best surface cleaning and treatment effects. Physical, Chemical, or Physical/Chemical Mode Cleaning Method.
  • Extremely High Cleaning Uniformity.
  • Very Little Gas Consumption.
  • Apply to Process before Die-bonding, Wire-bonding or Molding in IC Packaging or LED Packaging Applications.
  • Wafer Cleaning.
  • Suitable for Flip-Chip, PBGA, Window-BGA, Mini-BGA, Micro-BGA, QFN/MLP, TFBGA (Film-BGA), LFBGA, VBGA (EBGA), Pin BGA, QFN/MLP, TCP, PCB, COB, Cu L/F, Ag-Plating L/F, Fe L/F, MMC, SD, Micro-SD, etc. Suitable for Surface Treatment (Cleaning, Modification) for Electronics or Non-electronics Devices/Components.